gaas spst switch dc - 6.0 ghz rev. v6 masw6020g 1 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support features ? low insertion loss, 0.6 db @ 1.0 ghz ? fast switching speed, 10 ns ? ultra low dc power consumption ? integral static protection ? rohs* compliant description the masw6020g is a gaas mmic spst switch die. this die is ideally used where low power consumption is required. typical applications include transmit / receive switching, switch matrices and switched filter banks, wlan ieee 802.11a and 802.11 b/g systems. other applications include cordless phones and base stations. part number package masw6020g die 1 bond pad dimensions pad layout parameter absolute maximum control value (a/b) - 8.5 vdc max input rf power +34 dbm (500 mhz - 4 ghz) storage temperature - 65c to +175c operating temperature +175c absolute maximum rating 2,3 2. exceeding any one or combination of these limits may cause permanent damage to this device. 3. m/a - com technology solutions does not recommend sustained operation near these survivability limits. bond pad dimensions - inches (mm) rf1, rf2 0.004 x 0.008 (0.100 x 0.200) alt rf 0.004 x 0.005 (0.100 x 0.125) a, b 0.004 x 0.004 (0.100 x 0.100) gnd1 0.012 x 0.007 (0.300 x 0.175) gnd2 0.009 x 0.008 (0.225 x 0.200) term 0.004 x 0.008 (0.100 x 0.200) schematic die size - inches (mm) 0.05 x 0.03 x 0.004 (1.270 x 0.770 x 0.250) *restrictions on hazardous substances, european union directive 2002/95/ec. 1. die quantity varies. ordering information b a a l t r f r f 2 q 4 t e r m g n d 2 b a g n d 1 2 k r f 1 2 k 2 k q 1 q 2
gaas spst switch dc - 6.0 ghz rev. v6 masw6020g 2 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support electrical specifications: 0 / - 5 v parameter test conditions units min. typ. max. insertion loss dc - 1.0 ghz l/t/h dc - 2.0 ghz l/t/h dc - 6.0 ghz l/t/h db 0.8 /1.0/0.9 0.9/1.1/1.0 2.5/2.7/2.5 isolation dc - 1.0 ghz l/t/h dc - 2.0 ghz l/t/h dc - 6.0 ghz l/t/h db 30/63/64 22/46/52 11/14/19 vswr dc - 1.0 ghz l/t/h dc - 2.0 ghz l/t/h dc - 6.0 ghz l/t/h ratio 1.1:1/1.1:1/1.1:1 1.3:1/1.2:1/1.1:1 2.0:1/2.7:1/2.0:1 input p1db above 500 mhz - 0/ - 5v / 0/ - 8v 100 mhz - 0/ - 5v / 0/ - 8v dbm +27 / +33 +21 / +26 ip2 two tone input power up to +5 dbm above 500 mhz 100 mhz dbm +68 +62 ip3 two tone input power up to +5 dbm above 500 mhz 100 mhz dbm +46 +40 control current v in low (0 to C 0.2 v) v out high ( - 5 v @ 50 a typ to C 8 v) a 20 300 t - rise, t - fall 10% to 90% rf and 90% to 10% rf ns 10 t on , t off 50% control to 90% rf, and 50% control to 10% rf ns 10 transients (in band) mv 10 option control voltage switch condition & bonding ground bonds a b rf1 rf2 alt gnd1 gnd2 term t 1 0 on on g g 0 1 off off g g l 1 0 on on g g 0 1 off off g g h 1 0 on on g g 0 1 off off g g truth table 4,5 4. differential voltage, v (state 1) - v (state 2), must be 2.5 v minimum. 5. 0 = 0 to C 0.2 v, 1 = - 5 v @ 10 a typical to - 8 v.
gaas spst switch dc - 6.0 ghz rev. v6 masw6020g 3 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support typical performance insertion loss vswr isolation 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 low loss terminated low loss reflective high isolation frequency (ghz) 1.0 1.5 2.0 2.5 3.0 0 1 2 3 4 5 6 low loss terminated low loss reflective high isolation frequency (ghz) 10 20 30 40 50 60 70 80 90 0 1 2 3 4 5 6 low loss terminated low loss reflective high isolation frequency (ghz)
gaas spst switch dc - 6.0 ghz rev. v6 masw6020g 4 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support mounting the masw6020g is back - metallized with pd/ni/au (100/1,000, 10,000 ?) metallization. it can be die - mounted with ausn eutectic preforms or with thermally conductive epoxy. the package surface should be clean and flat before attachment. eutectic die attach: a. a 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255c and a tool temperature of 265c. when not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290c. b. do not expose the masw6020g to a temperature greater than 320c for more than 20 seconds. no more than 3 seconds for scrubbing should be required for attachment. epoxy die attach: a. apply a minimum amount of epoxy and place the masw6020g into position. a thin epoxy fillet should be visible around the perimeter of the chip. b. cure epoxy per manufacturers recommended schedule. c. electrically conductive epoxy may be used by is not required. wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. b. wirebonds should be started on the chip and terminated on the package. handling precautions permanent damage to the masw6020g may occur if the following precautions are not adhered to: a. cleanliness masw6020g should be handled in a clean environment. do not attempt to clean unit after the masw6020g is installed. b. static sensitivity all chip handling equipment and personnel should be dc grounded. c. transient avoid instrument and power supply transients while bias is applied to the masw6020g. use shielded signal and bias cables to minimize inductive pick - up. d. bias apply voltage to either of the complementary control ports only when the other is grounded. no port should be allowed to Dfloat. e. general handling it is recommended that the masw6020g chip be handled along the long side of the die with a sharp pair of bent tweezers. do not touch the surface of the chip with fingers or tweezers. handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices.
gaas spst switch dc - 6.0 ghz rev. v6 masw6020g 5 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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